Qfn package design rules book

Designing product packaging logos, web, graphic design. The 6mil line and spacing design rules for leadframe mlfqfn dictates a wide pitch of 12 mils. Two types of rigid laminate construction were used. The data showed that dual row qfn resulted in more voiding than the single row qfn component.

This style of package was selected for investigation. Package design workbook explains all the ins and outs of packaging design in depth. Qfn package design played a critical role in voiding formation of the solder joint. Quikpak, originally founded in 1994 as spt, was purchased by delphon industries in 2000. The mapmolded, sawn type is the standard for nxps packages. For the last 15 years, quikpak has provided fast turn ic packaging, assembly, prototype and wafer processing services to a wide variety of semiconductor and electronics companies, as. Examples of small size qfn and son package types figure 2. Trials were also conducted for qfns processed onto flexible circuits using similar design rules and process parameters as for the rigid boards. The vq100 package has the easiest layout and uses very common, lowcost pcb dimensions, as shown in table 6. Board layout and stencil information for most texas instruments ti quad flat.

Qfn package is probably the most successful package type today. The qfn can have a single or a multiple rows of pins. When the qfn package design needs to start the assembly house will ask you for a few documents. They will help you prepare your classes for use in packages. The major features a of the final package design are listed in table 1. Nxp adopted the package design rules under jedec, documents mo220 standard qfn, and mo229, mo241 sondfn, respectively. Ipc7526 stencil and misprinted board cleaning hand book. Qfn package could be used in a variety of applications. Air cavity qfn packages openmolded plastic packages ompp quikpaks exclusive openmolded plastic package ompp is a premolded, air cavity qfn package quad flat nolead designed to provide a high quality, fast solution for your ic packaging and ic assembly needs. The second part covers the important, yet lesser known package design principles. Premolded cavity qfn package from global chip materials.

Design guidelines for cypress quad flat nolead qfn packaged devices. Section view of a qfn package sloa122 july 2006 qfn layout guidelines 1 submit documentation. In the past few years, advanced qfn packages with large body sizes 10 mm and multirow external terminals two or more rows as well as small body devices with ultrafine pitch package classifications 14 3 special packages package symbol type package types old new pin count cob chip on board ks ka custom design tcp tape carrier package avz va custom design memory module socket type ys bs ds ya yb yc yd ye special packages cot chip on tape d r a c c i c k. If pin pitch and body width are the same youre on the right track but this is never a guarantee. Jan 21, 20 qfn package is probably the most successful package type today.

Qfn 5532050x 5 mm package model description the pkgbaiqfn5532001 is a simulation based equivalent circuit model of barry industries pn qfn 5532050x molded 5 mm quad flat no lead qfn surface mount package. While drqfn packages share common characteristics with conventional qfns in terms of design, performance and reliability12 3, surface mounting stands out as a major challenge in the package. The dualrow or multirow qfn package utilizes an interstitial lead design that. Bottom terminated components and quad flat nolead btcqfn packages have been.

An2265 assembly guidelines for land grid array lga. Ic packaging design and modeling ic packaging complexity levels are rising yearbyyear in lock step with process advances and electrical performance enhancements. Body of knowledge bok for leadless quad flat noleadbottom. To view the new drawing, go to and search on the new 98a package number for your device. The qfn is a leadless package where electrical contact to the pcb is made by soldering the leads on the bottom surface of the package to the pcb, instead of. Htcc design possibilities package types multilayer technology provides 3 dimensional design flexibility for high performance requirements ceramic to metal htcc technology provides design freedom for ceramic feedthroughs in metal housings circular and rectangular the limitless design configurations provide the highest density. Drmos soldering guidelines recommendations for printed. Ansys hfss 3d simulation data was used to create model.

Offering low price, excellent performance and small size, it is an ideal package for many applications. Reproduction of information in ti data books or data sheets is permissible only. Circuits assembly online magazine lgaqfn solderability. Package design workbook addresses all aspects of the creative process including choosing a package format, colors and materials, final finishes, and special considerations such as awkward objects and unique display considerations. Land pad and exposed pad design is the key to boardlevel reliability, and texas instruments strongly recommends following the design rules included in the application note. Qfn quad flat noleaddfn dual flat nolead is a near cspchip size package plastic encapsulated package using conventional copper leadframe technology. Design guidelines for cypress quad flat nolead qfn packaged. The quad flat nolead qfn package is a csp plastic encapsulated package with a copper lead frame substrate. In principles of package design matthias noback tells you everything about designing software components, also known as packages. Pcb design perfection starts in the cad library part 15 qfn.

Make sure all files are saved in the cmyk color mode and 300dpi resolution. Package mounting guide qfn toshiba electronic devices. Pcb land pattern design and surface mount guidelines for. A significant effect on mounting the qfn package on the board and the quality of. Intersils quad flat no lead qfn package family offering is a relatively. This book breaks down the process of design in a much more comprehensive way than most books on the subject, which. The bond diagram shows an example for a 16 pin qfn. Lgaqfn solderability can be a challenge, and with an increasing number of components produced in this format, care needs to be taken to find a suitable test method. The qfn dimensions used in the land pattern design.

This is because of its low cost, compared to other package types. Flat noleads packages such as quadflat noleads qfn and dualflat noleads dfn. This document describes the printed wiring board design and the pcba guidelines. While dr qfn packages share common characteristics with conventional qfns in terms of design, performance and reliability12 3, surface mounting stands out as a major challenge in the package. Electrical connection recommendations for the exposed pad on qfn and dfn packages. For more information about qfn package use, see eb806. The layout recommendations for the cc256x qfn device described in this document are based on two routable layers and two solid ground layers layer 2 and layer 4. This package can be easily mounted using standard pcb assembly techniques and can be removed and replaced using standard repair procedures. For the last 15 years, quikpak has provided fast turn ic packaging, assembly, prototype and wafer processing services to a wide variety of semiconductor and electronics companies, as well as major military and aerospace institutions. Examples of large size qfn and son package types nxp adopted the package design rules under jedec, documents mo220 standard qfn, and mo229, mo241 sondfn, respectively. Refer to published reports, books, papers 410 for this category of. Because the qfn platform represents the latest in surface mount packaging technology, it is important that the design of the printed circuit board pcb, as well as the assembly process, follows the suggested guidelines outlined in this document.

Tn1257 pcb layout recommendations for qfn packages. Even if the device ds doesnt give you land patterns, you should be able to tell by comparing the pad sizes between two similar parts. Here in komex we found a way to inspect qfns since we dont have any xray machine in line to verify the well soldering. Applications requiring low standoff heights, improved thermal performance, reduced size or reduced weight are good candidates for qfn designin. Qfn is a lead framebased package which is also called csp chip scale package with the ability to view and contact leads after assembly. Cadence ic package design technology ic packaging is now a critical link in the siliconpackageboard design flow. The first portion talks about the history, art and science of package design.

The quad flat pack no leads qfn style of leadless packaging is becoming ever more used for many applications in printed circuit board assembly. Qfn quadflat noleads is a plastic smt package consisting of. Packaging essentials outlines and demonstrates basic package design guidelines and rules through 100 principles in the areas of research, planning, and execution. The qfn package is a thermally enhanced standard size ic package designed to eliminate the use of bulky heat sinks and slugs. Qfn package dimensions and tolerances, refer to the packaging specification ds00000049. Qfn package style is relatively new, such industry guidelines for it. What size land pad should i design on my board for these packages. This book is a quick reference and primer on package design and the principles that make design projects successful. The cadence allegro environment offers complete and scalable technology for the design and implementation of pcbs, packages, and systemsinpackage sips. Experimentation with qfn packages of similar size has shown that these packages. The book is really split into three major portions although there are six chapters.

And8086d board mounting notes for quad flatpack nolead. Pcb design and rework, package performance information such as mo isture sensitivity level msl rating, board level reliability, mechanical, and thermal resistance data are also included for reference. And8086d board mounting notes for quad flatpack no. The package structure conducts a costeffective packaging solution that benefits to minimize package size as well as enhances thermal and electrical performance over the traditional leaded. Pcb land pattern guidelines the qfndfn is a surface mountable package with bottom termination of its external connections pins. Each cad and any associated text, image or data is in no way sponsored by or affiliated with any company, organization or realworld item, product, or good it may purport to portray. Similar qfn type, but different package design, would result in different voiding level, as shown in the case of qfn2 and qfn156 figure 16. In the past few years, advanced qfn packages with large body sizes 10 mm and multirow external terminals two or more rows as well as small body devices with ultrafine pitch jan 01, 2008 theres a lot that goes behind package design. Qfn package technology is ideal for power conversion devices due to the solderable exposed bottom copper leadframe for thermal dissipation and the resulting low package thermal resistance, the smaller package footprint and thickness, large lead size and pitch, and excellent lead coplanarity. Some key qfn design considerations are pad and stencil design. Package dimensions dfn10, qfn24, qfn28, cqfn32, qfn48 release b2, page 33 mm min.

Open cavity qfn package global chip materials manufactures premolded open cavity qfn packages in standard jedec body sizes and lead counts. Cell phones, pdas, portable music and video players can significantly benefit from this package. The quad flat nolead qfn package is a leadless nearchipscale package csp that is growing in popularity due to its compact size, reduced weight, and excellent thermal and electrical characteristics. Quikpak s exclusive openmolded plastic package ompp is a premolded, air cavity qfn package quad flat nolead designed to provide a high quality, fast solution for your ic packaging and ic assembly needs. Flat noleads packages such as quadflat noleads qfn and dualflat noleads dfn physically and electrically connect integrated circuits to printed circuit boards. In my experience qfn and tqfn are pretty similar for example that program doesnt list tqfn, only qfn. Reproduction of ti information in ti data books or data sheets is permissible only if. Simulation results and model validated against measured data to 40. In the first part youll revisit the solid principles of class design. Board level reliability and assembly process of advanced qfn. Design guidelines for cypress quad flat nolead qfn. High temperature cofired ceramic htcc package design and. If a qfn package with an lti feature is used, a solder joint fillet at the side wall of the qfn land is enabled, because an lti feature provides a partly plated and therefore wettable side wall at.

Qfn packages avoid routing between the flag and the pads of a qfn device, as shown in figure 4 below. Assembly guidelines for qfn quad flat nolead and son. The free e book for packaging and graphic designers containing a collection of editable retail packaging dielines that are ready to download, design, and share. Once your client has approved the final design, send them all of the design files. Pcb layout recommendations for leaded packages vq100 quadflat package for applications that require 72 pio pins or less and where board space is not the primary concern, the vq100 package is the best option. When it comes to bond pad design two approaches can be taken. The quad flat nolead qfn package has been used widely since its introduction in 1998.

Cypress qfnpackaged devices offer a near chipsized footprint with a high io count compared with standard leaded ic packages, such as small. Flat noleads, also known as micro leadframe mlf and son smalloutline no leads, is a surfacemount technology, one of several package technologies that connect ics to the surfaces of pcbs without throughholes. Good design rules and assembly processes will result in high soldering yields. The land pattern design for all qfn type packages is based on the ipc7093 and ipc7351 standards. Qfnquad flat noleaddfn dual flat nolead is a near cspchip size packageplastic encapsulated package using conventional copper leadframe technology. Routing and vias between the flag and the pads can easily be shorted to either the flag or to the pads because of the physical dynamics of the solder under the device. Two different package configurations were used, so as to have different types of side terminations.